Things That Goes Into Manufacturing Of PCB
Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
Photo imaging is used to achieve the final design of the circuit. The final thickness is also arrived at by electroplating copper. Protection of the final circuits in the next etching is quite vital and hence, a thin layer of tin or lead solder should be applied. The copper will not form the final circuit and should therefore be removed. Sulfuric acid or a solution containing ammonia is used to etch away the unwanted copper.
Alternative resists can also be obtained by use of other volatile organic compounds or photosensitive ones. These ones can be applied either wet or dry. When exposed to ultraviolet light, the compounds normally harden.
A roller, squeegee, spray or silk screen can be used to apply the liquid resist. The liquid can be applied on either or both sides or just on a specific area on the surface. Light can be used in order to get better circuits.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
High heat and pressure are applied to the book which is placed in a lamination press. A bond will be formed as the epoxy layers are melted down by the intense heat and pressure. Holes are drilled into it. However, this should only be done after it has been trimmed and buffed as required. The desired results can only be achieved by following the required procedure well and adhering to each and every detail in the stages involved in manufacturing of PCB.
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